White Papers and Case Studies
AUTOSAR based PLC for intelligent charging ECUsWhite Paper
As discussed in this paper, the Telemotive Intelligent Charging solution, along with the integration of AUTOSAR at the ECU level, offers the user/driver an error-free communication between charging station...
Integrated Verification: A Shift-Left Solution for a More Efficient Design FlowWhite Paper
The rapidly increasing complexity of today’s designs, combined with schedule pressure to deliver innovative products to market as quickly as possible, strains engineering resources to the limit, often...
Monolithic versus Heterogeneous Packaging: Where Does the Future Lie?White Paper
Cost, risk, and the limitations of monolithic scaling are driving the growth of multi-die (heterogeneous) advanced IC packaging solutions. The integration of different functions into a highly optimized,...
System Performance Modeling: An SV Adaptive Rate Control Stimulus Generation MethodologyWhite Paper
This paper examines the process of verification of an SoC consisting of multiple ARM AMBA® AXI™ bus fabrics with a mix of RTL IP and verification IP master and/or slave blocks. Specifically, we...
CMP simulation solves manufacturing errors before they actually existWhite Paper
SK Hynix and Mentor teamed up to demonstrate how CMP modeling and simulation can predict device damage caused by dishing and thickness variation. Foundries can use this information to provide design companies...
Dark matter, dark energyâ¦What about dark errors?White Paper
The complexity of error waivers grows right along with the increase in design complexity and rules. EDA software continuously introduces new automated waiver management capabilities to ensure design teams...
Designing Fast Load Transient Digitally-Controlled DC/DC Converters Using SymphonyWhite Paper
The team at University of Illinois Urbana Champaign was looking to design a digitally controlled DC-to-DC converter that leveraged a feed forward technique to significantly improve the load transient response....
Surviving the Three Phases of High Density Advanced Packaging DesignWhite Paper
The growth of High Density Advanced Packages (HDAP) such as FOWLP, CoWoS, and WoW is triggering a convergence of the traditional IC design and IC package-design worlds. To handle these various substrate...
Upcoming Webinars and Events
|Nov 22, 2018||Bengaluru|
Mentor forum for Emulation 2018 India
At this event, you will hear a wide variety of speakers, including an interesting line up of technology partners, talking about how emulation is making a difference in the success of businesses across the...
Self-Testing in Embedded Systems
Complex electronic systems always carry a risk of failure, as does complex software. An embedded system may be designed to monitor possible failure conditions and either prevent the failure from occurring...
User2User Munich 2018
The PCB Forum has been successful bringing customers and Mentor specialists together, delivering tips and tricks to enable our customers to be more productive, use the tools more efficiently and see the...
Cisco: RTL Power OptimizationâPowerPro in Vector-Less Mode
In this webinar, Cisco's Udupi Harisharan will discuss their success in reducing and optimizing power consumption with PowerPro, achieving a CG efficiency gain of 10-20%.
|Nov 29, 2018||Online|
System-of-System Simulation Through FMI
In order to design safer and better performing products in less time and at lower costs, it is necessary to account for system interactions early in the design phase, using a System-of-systems simulation...
Recent Blogs (270) 201-0041
When Worlds Collide â HPC Meets EmbeddedRandy Allen
When is a DRC error not an error?Design With Calibre
Mentorâs New Symphony AMS platform timed perfectly for the build out of smarter, connected everythingMike Santarini
Portable Stimulus Modeling in a High-Level Synthesis Userâs Verification Flow
Portable Stimulus has become quite the buzz-word in the verification community in the last year or two, but like most ‘new’ concepts it has evolved from some already established tools and methodologies.
How To... Characterize an Automotive Thermostat for Thermo-fluid System Simulation
With the release of V8, FloMASTER has introduced functionality to fully model ORC systems so that engineers can consider key design parameters such as available superheat, high and low side system pressures,...
Trials and Demos
On-Demand, Online, and Classroom Training
Capital Training Library
Courses include interactive videos, written course materials, knowledge checks, and hands-on labs through the Mentor Graphics Virtual Lab platform. This platform utilizes a test environment where you can...
PADS Standard Plus Training Library
This library will show you how to use PADS Standard Plus to design PCB boards. It contains learning paths for schematic and PCB design.
|Dec 26, 2018 - Dec 28, 2018||Shanghai, China|
|Jan 22, 2019 - Jan 24, 2019||Nottingham, United Kingdom|
|Jan 29, 2019 - Jan 31, 2019||Meudon, France|
|Feb 12, 2019 - Feb 14, 2019||Stuttgart, Germany|
|Mar 26, 2019 - Mar 28, 2019||Meudon, France|
The FloTHERM XT course will teach you how to design, build and simulate simple to complicated electronics cooling related models.
|Dec 05, 2018 - Dec 07, 2018||Beijing, China|
|Dec 13, 2018 - Dec 14, 2018||Tokyo, Japan|
|Jan 29, 2019 - Jan 31, 2019||Hsinchu City, Taiwan, China|
Calibre Advanced Topics: Writing PERC Rules
This course will help you understand the wide breadth of problem areas addressed by Calibre PERC, including ESD, advanced ERC, multiple power domains, point-to-point resistance, and current density.
|Nov 25, 2018 - Nov 28, 2018||Herzliya, Israel|
|Nov 27, 2018 - Nov 29, 2018||Hsinchu City, Taiwan, China|
|Mar 05, 2019 - Mar 07, 2019||Hsinchu City, Taiwan, China|
|Mar 19, 2019 - Mar 22, 2019||Singapore, Singapore|
Calibre Fundamentals: Writing DRC/LVS Rules
This course will teach you to effectively write and maintain Calibre nmDRC and nmLVS rule decks for your semiconductor processes. In this class, you will extensively study the Standard Verification Rule...